Precision Grinding of Semiconductors
Hybrid and vitrified bond grinding tools represent a quantum leap in quality and reliability in semiconductor processing. Meister Abrasives’ diamond grinding tools target boule, puck, seed, and wafer grinding. With a best-in-class total topography (Sa, Sz, Bow, Warp, TTV), surface qualities in the one-digit Angstrom range are achieved. The specially developed grinding tools of Meister Abrasives are used for processing a wide range of materials such as silicon carbide (SiC), silicon (Si), polysilicon (poly-Si), sapphire (Al2O3), gallium nitride (GaN), indium phosphide (InP), gallium arsenide (GaAS), lithium niobate (LiNbO3), lithium tantalum (LiTa), and extremely hard ceramics.
Meister Abrasives’ innovative grinding wheel technologies allow prime wafer and device manufacturers to shorten wafer preparation steps to the minimum. For example, the ultra-smooth surface profile achieved by the UF6 DIA technology enables manufacturers to avoid diamond slurry costs, reduce chemical mechanical polishing (CMP) cost tremendously and drastically increase throughput.
Meister Abrasives
Our semiconductors expertise at a glance
Prime wafer and seed crystal substrate production
Grinding applications in the wafer-substrate production chain for materials, such as Si, SiC, sapphire, GaN, InP, GaAS, LiNb, LiTa, among others, including boule/ingot and edge grinding
Special wafer processing
Backgrinding and wafer thinning e.g. for SiC, MEMS, SOI, 3D-TSV, ultra-thin wafers, reclaim, eWlp or DBG grinding including special edge grindings
Power electronics and LEDs
Grinding processing in the value chain of LED’s and power device manufacturing for new e-Mobility applications based on SiC / GaN or Sapphire substrates
5G Technologies
Grinding processing for modern 5G Technologies used for SAW/BAW frequency filter devices based on LiTa-, LiNb- or Si-Wafer